Measurement Example of Environmentally Restricted Substances

Lead (Pb) in Thin Film Samples

We know that electroless nickel phosphorus plating and Pb-free solder plating contain small amounts of Pb that must be controlled as a hazardous element. SII NanoTechnology developed the Thin Film FP method for accurate measurement of plating samples.

[ Measurement of Electro-less Ni Plating ]

The table and figure below shows excellent results of 10 readings of approximately 350ppm of Pb in Ni-P plating (5um) over cupper. The correlation of Pb is less than 3%. The readings correlate well with ICP values.
< Measurement Conditions (SEA1200VX) >
Method : Thin Film FP
Beam Size : φ8.0mm
Voltage : 50kV
Current : Auto
Atmosphere : Air
Primary Filter :

For Pb

< Sample >
Electro-less Ni Plating 5µm

Pb Peak in Electroless Ni Plating
Pb Peak in Electroless Ni Plating 5µm
< ICP Result >
Pb 363ppm
< 10 Readings from SEA1200VX >
 
Ni-P(µm)
Pb(ppm)
Ave.
5.54
334
STDEV
0.26
8.66
CV%
4.68
2.59

[ Measurement of Pb Free Solder ]

Pb-free solder plating also contains a small amount of Pb. The table and figure below show excellent results from one reading of a Pb measurement in Pb-free solder plating 5 micro meters in thickness. The CV value of Pb concentration was less than 3% and the reading also correlates well with ICP.
< Measurement Conditions (SEA1200VX) >
Method : Thin Film FP
Beam Size : φ8.0mm
Voltage : 40kV, 50kV
Current : Auto
Atmosphere : Air
The Primary Filter:

For Pb & For Cd

< Sample >
Pb in Pb Free Solder 5µm
Pb Peak in Pb Free Solder
Pb Peak in Pb Free Solder 5µm
< ICP Result >
Pb 312ppm
< 10 Readings from SEA1200VX >
 
Sn-Ag(µm)
Pb(ppm)
Ave.
5.5
348
STDEV
0.02
8.95
CV%
0.27
2.57

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